Dual DIMM DDR2 and DDR3 SDRAM Interface Design Guidelines

Challenges in implementing DDR3 memory interface on PCB systems: a methodology for interfacing DDR3 SDRAM DIMM to an FPGA

TN-41-13: DDR3 Point-to-Point Design Support

• TN-00-20: Understanding the Value of Signal Integrity Testing • TN-41-02: DDR3 ZQ Calibration • TN-41-04: Dynamic On-Die Termination • TN-46-02: Decoupling Capacitor Calculation for a DDR Memory Channel • TN-46-06: Termination for Point-to-Point Systems • TN-46-11: DDR SDRAM Point-to-Point Simulation Process • TN-46-14: Hardware Tips for Point-to-Point System Design: Termination, Layout, and ...

The Evolution from DDR2 to DDR3 and its Impact on Signal Integrity

Applications demanding higher system bandwidth and lower power such as converged notebooks, desktop PCs and servers continue to drive the evolution of industry standards including DDR3 as defined by JEDEC. The latest DDR3 memory standard (JEDEC JESD79-3A) is designed specifically to support these needs and the requirements of emerging dual and multi-core processor systems. DDR3, the latest DDR ...

TN-41-02: DDR3 ZQ Calibration

Introduction For more robust system operation, the DDR3 SDRAM driver design has been enhanced with reduced capacitance, dynamic on-die termination (ODT), and a new calibration scheme. The capacitance reduction comes from the use of a new “merged” driver. With the new driver, circuitry that makes up the output driver is shared for use in ODT. Separate structures were used on DDR2 for the output ...

Analyzing Power Variability of DDR3 Dual Inline Memory Modules

Variability in modern digital integrated circuits is emerging as an important area of research as it can cause profound impacts on chip performance and power consumption. We found that memory power consumption in a mainstream Atom-based computer can be as much as 18.5% of the total system power. We investigated the power consumption of DDR3 SDRAM DIMMs, finding that power usage in memory is hea...